The combination of CoolCapTM and CoolShieldTM devices provides a new level of flexibility and performance repeatability for process engineers and rework technicians.

While automotive engine management and safety systems will be the main market drivers for Indian automotive electronics, production of cutting-edge digital instrumentation and electronic ignition systems is on the rise.

A current study at Portelligent, based on teardown data of over 270 cell phones, portable media players, handheld GPS, and digital still cameras and camcorders, indicates that the percent of handheld devices with multi-chip packages (MCP’s) has doubled from 45% in 2002 to 90% by the end of 2005.  However, among those devices that have adopted multi-chip packages, the quantity of MCP’s per device, on average, has remained nearly constant. 

Leading mobile-phone makers Nokia and Motorola Inc. will increase their semiconductor spending by the highest percentage among the world’s top-10 OEM chip buyers in 2005 and 2006, iSuppli Corp. predicts.

Antenova is a leading developer and supplier of high performance integrated antenna solutions for a wide range of wireless applications for mobile handsets, portable devices and other consumer electronics.

The workshop, "Lead-free: A Hands-on Workshop", will be held October 16-19, 2006 at the Rochester Institute of Technology campus in Rochester, NY. 

China’s rapid growth in electronic-design- generated semiconductor purchasing activity is continuing and the country is closing in on the United States and the other top nations.

Since it was founded in 1986, WKKT has grown to more than $218 million in sales for 2003.

The line is an industry first—it is an entire assembly system.

The North American rigid PCB industry book-to-bill ratio for August 2006 increased to 1.06.  The North American flexible circuit book-to-bill ratio also grew to 1.05.

K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys.

Wielding exceptionally high throughput and immense flexibility, Icon i8 has been specifically developed to meet the precise demands of the fast-paced Asian electronics market.

The FINEPLACER® Pico AMA offers users extreme flexibility.

Europlacer’s new solder ball feeders provide a low-cost solution for solder ball assembly.

The Helix provides the quality of automated device handling less expensively.

The Flex Ultra AOI system is an automated inspection solution for all stages of the SMT production process.

With the new Package-in-Package (PiP) and Package-on-Package (PoP) designs, there’s no room for planarity and coplanarity problems.

Over 40 attendees from Asia, Europe, Mexico, and the United States participated.

Until recently, Smart Sonic would build-to-order the Model 1550 “fully-loaded” semi-automatic stencil cleaner.  However, because of the huge demand, Smart Sonic has changed to an immediate delivery strategy.

Kester will provide lead-free resources, technologies and products in booth 616 at the upcoming Mexitrónica conference and exhibition, scheduled to take place October 10-12, 2006 in Guadalajara, Jalisco, Mexico.