With effect from 1st July 2010, SIPLACE Singapore appointed one of its pioneer members, Jack Chua as its new CEO, and Wei Hsien Low who was heading the Asian Purchasing Team will in addition also take the lead of the entire SIPLACE Center Asia as its Vice President.

Industry experts discuss business potential of setting solar power plants in India at SEMI panel discussion and SOLARCON India 2010 curtain raiser in Hyderabd on 7 July 2010.

New record in terms of performance per square meter: Siemens Electronics Assembly Systems's latest placement machine, SIPLACE SX4, places up to 120,000 cph on a footprint of only 1.90 x 2.65 meters.

HK Wentworth Limited, parent company of Electrolube, electro-chemicals manufacturer for the electronics and manufacturing industries reports spectacular results for their 2009/10 fiscal year.

Renesas Electronics and Nokia today announced that they are deepening their collaboration by forming a strategic business alliance to develop modem technologies for HSPA+/LTE (Evolved High-Speed Packet Access / Long-Term Evolution) and its evolution.

International Data Corporation (IDC) expects global semiconductor revenue to reach $274 billion, $295 billion, and $344 billion in 2010, 2011, and 2014, respectively, with a compound annual growth rate (CAGR) of 8.8% over the 2009-2014 forecast period.

RS Components today announced the launch of DesignSpark, the centrepiece of its initiative to provide an authoritative online design environment for engineers.

The flexible FRITSCH fully automatic machine placeALL®510 is the basis of production for the highly flexible production of smaller and medium-sized batches.

Aqueous Technologies Corp. announces that with the purchase of a Trident-CL, customers will receive a free Zero-Ion ROSE Tester or Ultrasonic Stencil Cleaner during the month of July.

HARTING’s world-first innovation receives award from “ke Konstruktion & Engineering” trade magazine of Germany.

Polyonics introduces the XF-603, a 1 mil white polyimide, halogen free label material that has been designed and recognized by UL to meet the difficult VTM-0 level of flame retardants per the UL94 standard.

Two IEEE standards on setting criteria for environmentally preferable electronic equipment will soon go to ballot: 1680.2 Draft Standard for Environmental Assessment of Imaging Equipment and 1680.3 Draft Standard for the Environmental Assessment of Televisions.

Multitest announces that it has once again been named one of the top ten chip making equipment suppliers in the annual Customer Satisfaction Survey conducted by VLSIresearch.

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS5000DMP Series Rotary Valve.

Seiko Epson Corporation and E Ink Corporation today announced a new jointly developed display controller IC.

High efficient LEDs from DOMINANT Opto Technologies are upgrading the exterior illumination of Chinese company Haima’s first SUV shown at the Beijing Auto Show on April 2010.

Integrated Micro-Electronics, Inc. (IMI) and Narra Venture Capital II (NarraVC), signed an agreement with PSi Technologies Inc. for their acquisition of 67% of PSi, a focused independent semiconductor assembly and test-service provider to the power semiconductor market.

SEHO Systems GmbH, a leading worldwide soldering provider, introduces the PowerRepair soldering system, designed for professional desoldering and soldering of through-hole components.

APS Novastar, LLC, a global leader in the design, development and manufacture of OEM solutions for short to medium run SMT and PCB assembly is pleased to announce the release of its LS60V-LED automated SMT Pick and Place machine.

Tyco Electronics, a global leader in engineered electronic components and solutions, has launched the Solderless LED Socket, Type CM, for easy integration of the new Cree XLamp® MP-L™ multichip LED into light fixtures.