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Friday, 03 September 2010 |
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Premier Farnell expands stock levels for these four trusted brands, offering electronic design engineers high quality and affordable products. |
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Thursday, 26 August 2010 |
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Magma Design Automation Inc. launched Quartz iPOP, the “improved Productivity, Operability and Performance” initiative to facilitate designers’ adoption of the Quartz™ DRC and Quartz LVS software for designs targeted at 65 nanometers (nm) and below. |
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Thursday, 19 August 2010 |
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LED-curing technology from Intertronics offers significant cost savings and efficiences in adhesive spot-curing applications. |
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Monday, 16 August 2010 |
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Tektronix today announced that its next-generation, scalable, performance oscilloscope platform will make broad use of IBM 8HP silicon germanium (SiGe) technology. |
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Friday, 13 August 2010 |
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Vitronics Soltec XPM3Vitronics Soltec announces the availability of the enhanced XPM3i Reflow System, offering improved performance in terms of ease of use, and lower cost of operation. |
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Friday, 13 August 2010 |
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BPM Microsystems announces the release of BPWin version 5.10, featuring new benefits for customers with software support such as e-mail notifications, black box log visualization and label printing. |
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Wednesday, 11 August 2010 |
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APS Novastar is pleased to announce the release of its new video covering its SPR line of Stencil Printers for printed circuit board (PCB) assembly. |
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Tuesday, 03 August 2010 |
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Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that its plastic adhesive tools are ideal for smoothing sealants and adhesives for many aerospace applications. |
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Tuesday, 20 July 2010 |
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SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, has completely redesigned the fluxer area of its wave soldering systems. |
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Monday, 19 July 2010 |
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The introduction at Semicon of Sonoscan’s high-throughput FastLine™ C-SAM acoustic microscope has brought praise from potential users of the system, Sonoscan reports. |
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Thursday, 15 July 2010 |
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The new introductions expand the total Vishay range available from RS Components to over 10,000 products across passive and semiconductor technologies. |
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Thursday, 15 July 2010 |
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The new 5008 series combines an IEC C8 inlet with a line filter for low power applications. The EMI filter is dimensioned as a 1-stage filter for rated currents up to 2.5A and 6A for IEC and UL respectively and are available as standard or medical version. |
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Wednesday, 07 July 2010 |
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New record in terms of performance per square meter: Siemens Electronics Assembly Systems's latest placement machine, SIPLACE SX4, places up to 120,000 cph on a footprint of only 1.90 x 2.65 meters. |
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Tuesday, 06 July 2010 |
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RS Components today announced the launch of DesignSpark, the centrepiece of its initiative to provide an authoritative online design environment for engineers. |
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Tuesday, 06 July 2010 |
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The flexible FRITSCH fully automatic machine placeALL®510 is the basis of production for the highly flexible production of smaller and medium-sized batches. |
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Tuesday, 06 July 2010 |
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Aqueous Technologies Corp. announces that with the purchase of a Trident-CL, customers will receive a free Zero-Ion ROSE Tester or Ultrasonic Stencil Cleaner during the month of July. |
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Monday, 05 July 2010 |
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Polyonics introduces the XF-603, a 1 mil white polyimide, halogen free label material that has been designed and recognized by UL to meet the difficult VTM-0 level of flame retardants per the UL94 standard. |
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Thursday, 01 July 2010 |
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Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS5000DMP Series Rotary Valve. |
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Wednesday, 30 June 2010 |
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Seiko Epson Corporation and E Ink Corporation today announced a new jointly developed display controller IC. |
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Tuesday, 29 June 2010 |
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SEHO Systems GmbH, a leading worldwide soldering provider, introduces the PowerRepair soldering system, designed for professional desoldering and soldering of through-hole components. |
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Monday, 28 June 2010 |
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APS Novastar, LLC, a global leader in the design, development and manufacture of OEM solutions for short to medium run SMT and PCB assembly is pleased to announce the release of its LS60V-LED automated SMT Pick and Place machine. |
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Monday, 28 June 2010 |
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Tyco Electronics, a global leader in engineered electronic components and solutions, has launched the Solderless LED Socket, Type CM, for easy integration of the new Cree XLamp® MP-L™ multichip LED into light fixtures. |
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Friday, 25 June 2010 |
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US based Aqueous Technologies Corp., the leading provider of batch defluxing systems, announces that its Trident eSPC Software is now available on all PC equipped Trident Defluxing Systems. |
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Friday, 25 June 2010 |
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US based Practical Components, a leading international supplier of solder training kits and materials, mechanical IC samples or “dummy” components and SMD production tools and equipment, announces the capability to design custom practice PC boards or complete kits. |
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Thursday, 24 June 2010 |
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ON Semiconductor launched a new family of high efficiency 2 - 4 Amp integrated synchronous regulators for consumer electronics applications such as set top boxes, DVD/hard disk drives, LCD monitors/TVs, speakerphones, cable modems, and telecom/datacom equipment. |
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Wednesday, 23 June 2010 |
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Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, has announced the industry's first Ion and photo smoke-detector ICs to offer alarm memory. |
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Tuesday, 22 June 2010 |
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Electrolube, has announced that it is adding a new product to its cleaning range. Reflow Oven Cleaner is a specially formulated micro-emulsion for cleaning reflow ovens and wave solder machines. |
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Monday, 21 June 2010 |
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Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, introduces the Trident OneShot automatic defluxing and cleanliness testing system. |
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Friday, 18 June 2010 |
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GOEPEL electronic GmbH and Agilent Technologies Inc. announced the release of the UCM3070 Boundary Scan plug-on module for the Agilent Utility Card of the Agilent Medalist i3070 Series 5 In-Circuit tester. |
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Thursday, 17 June 2010 |
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SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, sets a new milestone for the control of automized selective soldering processes with its new flux control which measures the actual flux quantity jetted by the drop jet nozzle during the process. |
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