|
Friday, 03 September 2010 |
|
Premier Farnell expands stock levels for these four trusted brands, offering electronic design engineers high quality and affordable products. |
|
|
Thursday, 26 August 2010 |
|
Magma Design Automation Inc. launched Quartz iPOP, the “improved Productivity, Operability and Performance” initiative to facilitate designers’ adoption of the Quartz™ DRC and Quartz LVS software for designs targeted at 65 nanometers (nm) and below. |
|
|
Thursday, 19 August 2010 |
|
LED-curing technology from Intertronics offers significant cost savings and efficiences in adhesive spot-curing applications. |
|
|
Monday, 16 August 2010 |
|
Tektronix today announced that its next-generation, scalable, performance oscilloscope platform will make broad use of IBM 8HP silicon germanium (SiGe) technology. |
|
|
Friday, 13 August 2010 |
|
Vitronics Soltec XPM3Vitronics Soltec announces the availability of the enhanced XPM3i Reflow System, offering improved performance in terms of ease of use, and lower cost of operation. |
|
|
Friday, 13 August 2010 |
|
BPM Microsystems announces the release of BPWin version 5.10, featuring new benefits for customers with software support such as e-mail notifications, black box log visualization and label printing. |
|
|
Wednesday, 11 August 2010 |
|
APS Novastar is pleased to announce the release of its new video covering its SPR line of Stencil Printers for printed circuit board (PCB) assembly. |
|
|
Tuesday, 03 August 2010 |
|
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that its plastic adhesive tools are ideal for smoothing sealants and adhesives for many aerospace applications. |
|
|
Tuesday, 20 July 2010 |
|
SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, has completely redesigned the fluxer area of its wave soldering systems. |
|
|
Monday, 19 July 2010 |
|
The introduction at Semicon of Sonoscan’s high-throughput FastLine™ C-SAM acoustic microscope has brought praise from potential users of the system, Sonoscan reports. |
|
|
Thursday, 15 July 2010 |
|
The new introductions expand the total Vishay range available from RS Components to over 10,000 products across passive and semiconductor technologies. |
|
|
Thursday, 15 July 2010 |
|
The new 5008 series combines an IEC C8 inlet with a line filter for low power applications. The EMI filter is dimensioned as a 1-stage filter for rated currents up to 2.5A and 6A for IEC and UL respectively and are available as standard or medical version. |
|
|
Wednesday, 07 July 2010 |
|
New record in terms of performance per square meter: Siemens Electronics Assembly Systems's latest placement machine, SIPLACE SX4, places up to 120,000 cph on a footprint of only 1.90 x 2.65 meters. |
|
|
Tuesday, 06 July 2010 |
|
RS Components today announced the launch of DesignSpark, the centrepiece of its initiative to provide an authoritative online design environment for engineers. |
|
|
Tuesday, 06 July 2010 |
|
The flexible FRITSCH fully automatic machine placeALL®510 is the basis of production for the highly flexible production of smaller and medium-sized batches. |
|
|
Tuesday, 06 July 2010 |
|
Aqueous Technologies Corp. announces that with the purchase of a Trident-CL, customers will receive a free Zero-Ion ROSE Tester or Ultrasonic Stencil Cleaner during the month of July. |
|
|
Monday, 05 July 2010 |
|
Polyonics introduces the XF-603, a 1 mil white polyimide, halogen free label material that has been designed and recognized by UL to meet the difficult VTM-0 level of flame retardants per the UL94 standard. |
|
|
Thursday, 01 July 2010 |
|
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS5000DMP Series Rotary Valve. |
|
|
Wednesday, 30 June 2010 |
|
Seiko Epson Corporation and E Ink Corporation today announced a new jointly developed display controller IC. |
|
|
Tuesday, 29 June 2010 |
|
SEHO Systems GmbH, a leading worldwide soldering provider, introduces the PowerRepair soldering system, designed for professional desoldering and soldering of through-hole components. |
|