Last month we covered the process of parallel gap welding, materials, specifications, the repair sequence and quality and inspection. Here we finish up with step-by-step instructions for three methods of repairing and replacing copper pads.

With the ever expanding electronics industry and the further integration of designs comes the reduction in size. Tracks and gaps become smaller, consequently increasing possibility for breaks to occur within the circuit.

Package on package (PoP) assembly is new to many engineers. PoP introduces different processes, materials and challenges, which will undoubtedly highlight some process defects.

Continued education is something everyone needs, but what are the alternatives to successfully disseminating experience and technical information in a cost effective manner?

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.

Synergy is broadly defined as the additive benefit that is garnered when two or more seemingly unrelated elements are joined, combined or brought together in some manner.

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.

Dave Bernard (Dage) and I have been considering a possible method of measuring the standoff height of PoP devices after soldering and the possible detection of any variation in the assembly process.

Dipping solder paste was developed or enhanced for package on package (PoP) assembly to improve yields after the initial use of dip fluxing materials were unable to overcome package warping during final assembly or at the pre-stacking stage in manufacture.

Normaly connectors in pin-in-hole intrusive reflow have the greatest impact on reflow delta T because they are BIG, so what happens with a higher reflow temperature with tin/copper solder paste?