Last month we covered the process of parallel gap welding, materials, specifications, the repair sequence and quality and inspection. Here we finish up with step-by-step instructions for three methods of repairing and replacing copper pads.

Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly methods employ a myriad of bonding processes, each one a vital step in the manufacture of the final product.

The wafer level chip scale package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of certain electronic products, especially handheld devices like cell phones.

With the ever expanding electronics industry and the further integration of designs comes the reduction in size. Tracks and gaps become smaller, consequently increasing possibility for breaks to occur within the circuit.

There is no doubt about it: automated machine processes are the most efficient methods for electronics assembly. That does not mean that there are not still occasions when hand soldering of individual components or assemblies is necessary.

This paper details a breakthrough technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs for faster delivery times, lower cost and access to finer pitch and smaller test targets.

Package on package (PoP) assembly is new to many engineers. PoP introduces different processes, materials and challenges, which will undoubtedly highlight some process defects.

Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different X and Y locations. In package on package (PoP) assembly, components are placed on successively higher layers. Since components are stacked on top of each other, traditional solder paste printing cannot be used.

Pressure indicating film can immediately produce an image of pressure variations across an entire surface area, allowing significant differences in bond pressure across wafer bonder surfaces to be identified and corrected.

In order to control and minimize damage caused to sensitive electronic devices, the Industry has come up with four important models of damage: The Human Body Model, The Charged Device Model, The Field Induced Model and the Machine Model.

This paper will share current results of Amkor’s WLCSP board level reliability testing for both larger package size and smaller pitch.

Head-in-pillow (HIP) or head-on-pillow (HOP) is the phenomena that can occur when incomplete wetting of a solder joint occurs after solder paste coalesces around, or near to, a ball grid array (BGA) solder ball after reflow but does not inter-mix, resulting in an open joint.

Continued education is something everyone needs, but what are the alternatives to successfully disseminating experience and technical information in a cost effective manner?

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.

The quality of the circuit board‘s pad is a critical factor in the reliability of the solder joint attaching the BGA.

When COB is merged within mainstream SMT, the choice of metallization has to serve both the SMT process and bonding—that choice can be a make or break factor.

Ever since the Human Body Model was suggested in order to explain the cause of mining disasters, the fact that electrostatic discharges can cause serious problems of safety has been recognized.

Merging COB into mainstream surface mount processes significantly improves footprint efficiency and cuts cost and lead-time.

Synergy is broadly defined as the additive benefit that is garnered when two or more seemingly unrelated elements are joined, combined or brought together in some manner.

Inevitably all stencils need to be cleaned to remove solder paste residues from the surface of the foil and from the apertures to prevent it drying and giving missed/incomplete prints.